PAPERS PENDING 2012
(currently updating page & WEBSITE to include numerous new journal papers): February 2012 PAPERS (And their equivalents) PUBLISHED:
(57 1st authored of 68 total up to the end of 2011 published), (2 more expected for year ending 2012).
2012
| 4-[72] [Report – book – In planning] | Chiodo, Industry Update: Design for Disassembly Update., 2012. |
| 3-[71] [referreed journal paper IN PLANNING] | Chiodo, et al. Redesigning LCDs for Remanufacture: Guidelines: Active Disassembly, 2012. UK |
| 2-[70] [In planning] | Chiodo, LCDs and Mercury: Toxicity, Clean Segretation, Recycling and ReDesign. |
| 1-[69] [referreed journal IN WRITING] | Chiodo, and Jones, N., IJCIM, 2012 Active, 2012. UK |
2011
| 3-[68] [ refereed journal paper] | Chiodo, J., (2011) “Smart Materials use in Active Disassembly”, Assembly Automation, Vol. 32 Iss: 1, General Review, Assembly Automation, ISSN: 0144-5154. Emerald Group Publishing Limited. |
| 2-[67] [refereed journal paper] | Chiodo, J. D., Grey, C., Jones, D., Design for Remanufacture, Recycling and Reuse, ICOR 2011, 27-29 July, 2011, Glasgow, UK |
2010
| 2-[65] [refereed journal paper] | Ijomah W.L and Chiodo JD (2010)Application of Active Disassembly to extend profitable remanufacturing in small Electrical and Electronic products”, International Journal of Sustainable Engineering, Vol 3, Issue 4 Ijomah W L (2010) |
| 1-[64] [refereed conference paper] | Chiodo J and Ijomah WL (2010) “Use of product self-disassembly technology to improve Remanufacturing Productivity”, 5th International Conference on Responsive Manufacturing, ‘Green Manufacturing’; 11- 13 January 2010, Ningbo, China |
2009
| 2-[63] [refereed conference paper] | Chiodo J and Ijomah WL (2009) “Active Disassembly aspplication to enhance Design-for-remanudfacture” The 18th International Conference on Flexible Automation and Intelligent Manufacturing (FAIM 2009), 6-9 July 2009, Middelsbrough, UK. |
| 1-[62] [internal report] | Chiodo, LCD Re-Design & Guidelines: Active Disassembly, 2009. UK |
2008
| 1-[61] [internal report] | Chiodo, AD for Complexity Reduction in Manufacture: Active Disassembly, 2008. |
2007
| 1-[60] [internal report] | Chiodo, J. D. et al., Active Disassembly for Multiple Markets: Active Disassembly, 2007. |
2006
| 1-[59] [proprietary report] | Chiodo, et al., – Active Disassembly for Liquid Crystal Displays – Laptops & Desktops: Active Disassembly, 2006. |
2005
| 3-[58] [proprietary report] | Chiodo, et al., Active Disassembly for Liquid Crystal Containing Large Displays >10cm2: Active Disassembly, 2005. |
| 2-[57] [proprietary report] | Chiodo, et al., Assessment of Novel AD Separation Technologies: Active Disassembly, 2005. |
| 1-[56] [proprietary report] | Chiodo, et al., Active Separation Technology: Exploratory Investigation: Active Disassembly, 2005. |
2004
| 2-[55] [refereed journal paper] | Jones, N., Harrison, D. J., Hussein, H., Billett, E. H., Chiodo, J. D, ‘Electrically Self-Powered Active Disassembly’, ‘Journal of Engineering Manufacture’ (ImechE Journal B), July 2004 Vol 218 No B7. ISSN 09544054 |
| 1-[54] [refereed journal paper] | Chiodo, J. D. and Boks,C, Assessment of End-of-Life Strategies with Active Disassembly using Smart Materials. The Journal of Sustainable Product Design 2: 69?82, 2002 ? 2004 Kluwer Academic Publishers. Printed in the Netherlands. |
2003
| 2-[53] [Bid Proposal] |
EPSRC/DTI/STI: ‘171,376 ‘Shape Memory Activation of Injection Moulding Components’, Principle Investigator Professor David Harrison, Co-investigator: Professor Peter Hornsby |
| 1-[52] [Bid Proposal] |
Active Disassembly Cascade Bid: ?30,000 venture capital money, Principle Investigator: Professor David Harrison and Dr. Joseph Chiodo, 2003 granted |
2002
| 7-[51] [refereed journal paper] | J D Chiodo, D J Harrison and E H Billett (2002) An initial investigation into active disassembly using shape memory polymers. In: Proceedings of the I MECH E Part B Journal of Engineering Manufacture, Vol.215, pp.733?741, DOI: 10.1243/0954405011518539 |
| 6-[50] [refereed journal paper] | J. D. Chiodo, N. Jones, E. H. Billett and D. J. Harrison, (2002) Shape memory alloy actuators for active disassembly using “smart” materials of consumer electronic products. Materials and Design,Vol. 23, Issue 5, pp. 451-521 |
| 5-[49] [refereed journal paper] | Jones, N., Harrison, D. J., Chiodo, J. D., Billett, E. H., ‘Design for Automotive Glass Removal Using Active Disassembly’, in the ‘Journal of Materials and Manufacturing’, SAE Transactions 2002. ISBN 0-7680-1289-9 |
| 4-[48] [refereed conference paper] | H. Hussein, J. D. Chiodo, E. H. Billett & D. Harrison , ‘Design Principles for Active Disassembly’, R2002 Conference, Geneva, February 2002 |
| 3-[47] [refereed conference paper] | N. Jones, D.J Harrison, J.D. Chiodo, E.H. Billett, ‘Design for Automotive Glass Removal Using Active Disassembly’, ATT – Automotive and Transportation Technology Congress, 2001- Paris, France, 9-11 July 2002. |
| 2-[46] [refereed conference paper] | N. Jones, D.J Harrison, J.D. Chiodo, E.H. Billett, ‘Safe Steering Wheel Airbag Removal Using Active Disassembly’, Int’l Design Conference ‘ Design 2002, Dubrovnik, May 14 – 17, 2002. |
| 1-[45] [Bid Proposal] |
EPSRC, ~’200,000: ‘Creep in Shape Memory Polymers’, Investigators: Professor Eric Billett, Professor David Harrison, Dr Marius Perkins and Dr George Simpson. Co-Author: Joseph Chiodo: Department of Design, Faculty of Technology, Brunel University, Runnymede Campus, Egham, Surrey. TW20 OJZ, submitted February 2002. |
2001
| 1-[44] [refereed conference paper] | N. Warburg, C. Herrmann, J. D. Chiodo., ‘Accompanying the (re)design of products with environmental assessment (DfE) on the example of ADSM’. 2001 IEEE Int’l Symposium on Electronics and the Environment – ISEE – May 2001, Denver, CO, USA. |
2000
| 11-[43] [government report] | Chiodo, J.D., Billett, E. H. and Harrison, D.J. (2000) Design Principles for Active Disassembly. Part I of: Final EPSRC Grant GR/L74385 Project Report |
| 10-[42] [government report] | Chiodo, J.D., Billett, E. H. and Harrison, D.J. (2000) Active Disassembly using Smart Materials (ADSM): Design Principles. Part II of: Final EPSRC Grant GR/L74385 Project Report |
| 9-[41] [Industry report] | J.D.Chiodo, ADSM Feasibility Study for Telecommunication Goods: End-of-Life Strategies. A study for Active Recycling Ltd., UK. 1 March 2000 |
| 8-[40] [poster presentation] |
Chiodo, J. D., Harrison, D. J. and Billett, E. H., ‘Active Disassembly Shape Memory Alloy Technology’, COM 2000 – The Conference Of Metallurgists, Ottawa Congress Centre, Ontario, Canada, (Aug., 20-23, 2000) |
| 7-[39] [refereed conference paper] | Chiodo, J. D., Billett, E. H., Harrison, D. J., Perkins, M. and Anson, A (2000) Cu-Zn-Al SMA Activators for Active Disassembly Using SMART Materials. In: Actuator 2000, 7th International Conference on New Actuators & International Exhibition on Smart Actuators and Drive Systems. Bremen, Germany, 19-21 June 2000. ISBN 3-933339-02-2 |
| 6-[38] [refereed conference paper] | Chiodo, J., Casper. B., Billett., E. and Harrison. D., ‘A feasibility study on active disassembly using smart materials – preliminary analysis of plastics dominated product’, To be published in the proceedings of the R’2000 International Conference Recovery, Recycling and Re-integration. The Congress will be held for the first time outside of Europe; in Canada, June 5 – 9, 2000, at the Toronto Convention Centre., Toronto, Ontario, Canada. ISBN (publication in June 2000), download: R2000, Toronto |
| 5-[37] [Invited Speaker Presentation] | ETMUEL workshop No.5, 2000, Chiodo, J.D., ‘Case study: Eco-Design and smart materials’, 2 June, 2000, The Surrey Institute of Art & Design, University College, Farnham, Surrey, UK. |
| 4-[36] [refereed conference paper] | Chiodo, J. D., McLaren, J., Billett, E. H. and Harrison, D. J., ‘Isolating LCD’s at End-of-Life using Active Disassembly Technology: A Feasibility Study.’, To be published in the proceedings of the IEEE International Symposium on Electronics and the Environment. May 8-10 2000. San Francisco. California. Institute of Electrical & Electronics Engineers’, pp. 318 – 323. ISBN 0-7803-5962-3. |
| 3-[35] [Bid Proposal] |
NEDO, 2000: ‘Development of High Glass Transition Temperature (Tg), High Tensile Shape Memory Polymer for Active Disassembly’, Principal Investigator: Dr. Shunichi Hayashi. Co-Investigators: Joseph Chiodo and Dr. Gurhan Kalay. Co-Authors: Prof. Eric Billett and Dr. David Harrison: Department of Design, Faculty of Technology, Brunel University, Runnymede Campus, Egham, Surrey. TW20 OJZ, UK; Wolfson Centre, Brunel and Mitsubishi Heavy Industries, Nagoya, Japan, submitted 17 March, 2000. |
| 2-[34] [Invited Speaker Presentation] | NewPlastics 2000, Chiodo, J.D., ‘Active Disassembly using Shape Memory Polymers for the Consumer Electronics Industry’, 15 March, 2000, 14-16 March 2000, Crowne Plaza Hotel, Brussels, Belgium. |
| 1-[33] [Bid Proposal] |
EPSRC, 2000: ‘Creep in Shape Memory Polymers’, Principal Investigator: Dr Marius Perkins. Co-Investigators: Professor Eric Billett, Dr David Harrison, Dr George Simpson. Co-Author: Joseph Chiodo: Department of Design, Faculty of Technology, Brunel University, Runnymede Campus, Egham, Surrey. TW20 OJZ, submitted February 2000. |
1999
| 14-[32] [UK patent (filing)] |
Chiodo, J. D. and Billett, E. H. (Brunel University), “Releasable Fasteners”, 22 December, 1999. Application Filing No. #9930390.1. |
| 13-[31] [refereed conference paper] | Chiodo, J. D., Billett, E. H., Harrison, D. J. and Anson, A., ‘Active Disassembly using Smart Materials (ADSM) – Introductory Materials Overview’: The Forth International Conference on EcoMaterials, and the International Workshop on Materials Design and Processing for the Improvement of Materials Efficiency, Gifu, Japan, 9 – 10 Nov, 1999. |
| 12-[30] [refereed conference paper] | Chiodo, J. D., Billett, E. H. and Harrison, D. J., ‘Active Disassembly using Smart Materials: A Case Study; A Step Change to EIR and Technological and Market Benefits: 4th Asian Design Conference’, International Symposium on Design Science, (Nagaoka Institute of Design, 197 Miyazeki-cho, Nagaoka-shi, Japan, 30 – 31 Oct, 1999, http://www.nagaoka-id.ac.jp), ISBN 4-9980776-0-0 C3072. |
| 11-[29] [Published book Chapter] |
Chiodo, J. D., Billett, E. H., Harrison, D. J., Perkins, M. and Anson, A.W., ‘Shape Memory Alloy Actuators for ADSM of Consumer Electronic Products: 38th Gateway Annual Conference of Metallurgists’, (Quebec City, Quebec, Canada, 22 – 26 August, 1999), pp. 425 – 439. ISBN 0-919086-93-4. |
| 10-[28] [International patent] | Chiodo, J. D. and Billett, E. H. (Brunel University), “Method for disassembling different elements”, 19 Aug., 1999. Serial #09/319, 857, Published Application #PCT/GB97/03392 |
| 9-[27] [refereed book chapter] | Chiodo, J. D. and Billett, E. H., ‘Active Disassembly using Smart Materials (ADSM), Book Title ‘Green Electronics/Green Bottom Line’ Butterworth-Heinemann, Fulfillment Center, 225 Wildwood Ave. Woburn, MA, USA, July 1999), pp. 267 – 280, 0-7506-9993-0. |
| 8-[26] [refereed conference paper] | Chiodo, J. D., Boks, C., ?A Feasibility Study on Active Disassembly using Smart Materials — A Comparison with Conventional End-of-Life Strategies: Life Cycle Engineering: LCE?99?, (Kingston, Ontario, Canada, 21 – 23 June 1999), pp. 92 – 101. Proceedings of ?6th International Seminar of Life Cycle Engineering?, 1999. |
| 7-[25] [Bid Proposal] |
EU 5th Frame Work Programme, 15 June, 1999: ‘Active Disassembly using Smart Materials (ADSM)’. Co-Authored; Chiodo, J.D., Billett, E. H. and Harrison, D. J., Awarded 1 March 2000, 2.8 Million Euro (?1.9 Million). |
| 6-[24] [Invited Speaker Presentation / Research Assessment] | Chiodo, J.D., SCARE, 12 April, 99: ‘Active Disassembly using Smart Materials (ADSM) for Consumer Products’, submitted and awarded ‘A’ Rating for entire EU consumer electronics research sector. This was the highest granted rating in the EU. Gothenburg, Sweden, 4 June, 1999). |
| 5-[23] [Invited Speaker Presentation] | Chiodo, J.D., ‘Active Disassembly using Smart Materials (ADSM)’, GreenPack Network. GreenPack is a Nordic and international project focusing on the environmental performance in electronics supply chain, Gothenburg Sweden, 3 June, 1999. |
| 4-[22] [Invited Speaker Presentation] | Nokia Environmental Technology Conference – Internal, Chiodo, J.D., ‘Active Disassembly using Smart Materials for the Mobile Phone Industry’, 28 May, 1999, Nokia Research Centre, Helsinki, Finland. |
| 3-[21][refereed conference paper] | Chiodo, J. D., Billett, E. H. and Harrison, D. J., ?Active Disassembly Using Shape Memory Polymers for the Mobile Industry: 1999 IEEE Int’l Symposium on Electronics and the Environment – ISEE – 1999′ (Danvers, Massachusetts, 11 – 13 May 1999), pp. 151 – 156. ISBN 0-7803-5495-8 (softbound). |
| 2-[20] [Invited Speaker Presentation] | Chiodo, J.D., CARE “VISION 2000” Meeting, ‘Meeting of the Working Group ‘Innovative Product/System Design’, ‘Active disassembly using Smart Materials’, Chambery, France, 4 March, 1999. |
| 1-[19][refereed conference paper] | Chiodo, J. D., Billett, E. H. and Harrison, D. J., ‘Preliminary Investigations of Active Disassembly Using Shape Memory Polymers: EcoDesign’99: First International Symposium on Environmentally Conscious Design and Inverse Manufacturing’, IEEE, (Tokyo, Japan, 1 – 3 Feb 1999), pp. 590 – 596. ISBN 0-7695-0007-2. |
1998
| 4-[18][refereed Academic journal: paper] | Chiodo, J. D., Billett, E. H. and Harrison, D. J., Active Disassembly, Journal of Sustainable Design, Refereed Journal, October, 1998, pp. 26 – 36, ISSN 1367-6679 |
| 3-[17] [UK patent] |
Chiodo, J. D. and Billett, E. H. (Brunel University), “Improvements relating to product disassembly”, 17 June, 1998. Application #9625539.3, Published #2, 320, 277. |
| 2-[16] [Newsletter] | Chiodo, J. D., ‘Takeback and Recycling Initiatives for Electronic Equipment in Europe, Japan and The United States’: A.C.I.D.O., Association of Chartered Industrial Designers of Ontario, Canada, Summer, 1998 |
| 1-[15] [refereed conference paper] | Chiodo, J. D., Billett, E. H., Harrison, D. J., and Harrey, P. M., ‘Investigations of Generic Self Disassembly Using Shape Memory Alloys: 1998 IEEE Int’l Symposium on Electronics and the Environment – ISEE – 1998’ (Oak Brook, Chicago, Il, USA., 4 – 6 May 1998), pp. 82 – 87. ISBN 0-7803-4295-X |
1997
| 7-[14] [Bid Proposal] |
Waste Minimisation: EPSRC, 97: Active Disassembly using Smart Materials (ADSM), Design Principles, ADSM prototype system. Co-Authored; Chiodo, J.D., Billett, E. H. and Harrison, D. J., submitted and declined. |
| 6-[13] [Bid Proposal] |
Whole Life Cycle: EPSRC, 97: ?Active Disassembly using Smart Materials (ADSM), Outline Design Guidelines. Co-Authored; Billett, E. H., Harrison, D. J. and Chiodo, J.D., Awarded, 90,000 (140,000 Euro). |
| 5-[12] [refereed conference paper] | Chiodo, J.D., Ramsey, B.J. and Simpson, P., ‘The Development of a Step Change Design Approach to Reduce Environmental Impact through Provision of Alternative Processes and Scenarios for Industrial Designers: ICSID’97 The Humane Village Congress’ (Toronto, ON, Canada, 23 – 27 October, 1998). |
| 4-[11] [conference paper] | Chiodo, J.D., and Billett, E.H., ‘Socially Minded Industrial Design by Environmental Impact Reduction, Product Design Education 1997 – PDE’97 (Brunel University, Runnymede, Surrey, UK., July 1997), UK. |
| 3-[10] [conference paper] | Chiodo, J.D., and Billett, E.H., ‘Preliminary Outline Guidelines for Active Disassembly, Product Design Education 1997 – PDE’97 (Brunel University, Runnymede, Surrey, UK., July 1997), UK. |
| 2-[9] [official report] |
C. B. Boks and E. Tempelman, Internal document code K370, Future Disassembly and Recycling Technology for the Electronics and Automotive Industry, Faculty of Industrial Design Engineering, Delft University of Technology, April 1997. pp. 17 – 18. The Netherlands. (contribution only) |
| 1-[8] [refereed conference paper] | Chiodo, J. D., Anson, A.W., Billett, E. H., Harrison, D. J., and Perkins. M., ‘Eco-Design for Active Disassembly Using Smart Materials: Int’l Conference on Shape Memory and Superelastic Technologies’ (Pacific Grove, CA, USA., 2 – 6 March 1997), pp. 269 – 274. ISBN 0-9660508-1-9 |
1995
| 4-[7] [refereed article] | Chiodo, J.D., Jun, 1995, ‘Underdevelopment of the social and physical world by over-consumption and Planned Obsolescence’, (TFB), The Frugal Bugal periodical, Oshawa, Ontario, Canada. |
| 3-[6] [refereed article] | Chiodo, J.D., Mar, 1995, ?Characteristics of over-consumption?, (TFB), The Frugal Bugal periodical, Oshawa, Ontario, Canada. |
| 2-[5] [refereed article] | Chiodo, J.D., Feb, 1995, ‘Disposability in Consumption’, (TFB), The Frugal Bugal periodical, Oshawa, Ontario, Canada. |
| 1-[4] [refereed article] | Chiodo, J.D., Jan, 1995, ?Actuating the Consumer?, (TFB), The Frugal Bugal periodical, Oshawa, Ontario, Canada. |
1994
| 3-[3] [refereed article] | Chiodo, J.D., Dec 1994, ‘Technology Push, Market / Patent Control and Segmented Markets’, (TFB), The Frugal Bugal periodical, Oshawa, Ontario, Canada. |
| 2-[2] [refereed article] | Chiodo, J.D., Nov 1994, ‘Actuating the Consumer’, (TFB), The Frugal Bugal periodical, Oshawa, Ontario, Canada. |
| 1-[1] [refereed article] | Chiodo, J.D., Oct 1994, ‘Lifestyle of Over-Consumption’, (TFB), The Frugal Bugal periodical, Oshawa, Ontario, Canada. |
| 0-[0] [Master’s Thesis] | Chiodo, J.D., June 1994, ‘Environmental Optimization Through Industrial Design’, Manchester Metropolitan University, UK. 1994 |
PAPERS (And their equivalents) PUBLISHED:
(52 1st authored of 64 total up to Sept 2009)